Systems and methods for manufacturing header subassembly
AssigneePacesetter, Inc.
InventorsDino Bortolin, Ofer Rosenzweig
Life of this patent
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Abstract
The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.
Claims6
An implantable device comprising:
- a header configured to electrically couple the implantable device to a stimulation lead, the header comprising:
- a subassembly comprising:
- a web assembly comprising a first split web fused to a second split web;
- a conductor assembly at least partially encapsulated by and positioned between the first split web and the second split web;
- and
- an antenna assembly at least partially encapsulated by and positioned between the first split web and the second split web.
Dependencies are inferred from the claim text.