Single to multiple layer integral busbar structure

Abstract

A conductive structure includes: a single-layer busbar that is formed in a plate shape and constitutes a conductive path; and a multi-layer busbar that is configured by laminating a plurality of busbars which are formed as plates thinner than the single-layer busbar and that is joined to an end of the single-layer busbar and constitutes the conductive path. The multi-layer busbar includes a main body portion in which at least some of the laminated plurality of busbars are capable of mutual displacement relative to the busbars adjacent thereto, and a joining end located at a end of the main body portion on the single-layer busbar side and in which the laminated plurality of busbars are incapable of mutual displacement relative to each other, the joining end being joined to the end of the single-layer busbar.

Dependencies are inferred from the claim text.