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US 11,472,212 B2Granted
Device and method for embossing micro- and/or nanostructures
AssigneeEV Group E. Thallner GmbH
InventorsFriedrich Paul Lindner, Harald Zaglmayr, Christian Schon, Thomas Glinsner, Evelyn Reisinger, Peter Fischer, Othmar Luksch
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Abstract
An apparatus and a method for embossing micro- and/or nanostructures in an embossing material.
Claims44
An apparatus for embossing micro- and/or nanostructures in an embossing material, said apparatus comprising:
- an embossing module, comprising:
- a structured stamp;
- and
- an embossing element comprising at least one roller, the embossing element being configured to remove the structured stamp from the embossing material in a targeted manner when the structured stamp is in contact with the embossing material and between the embossing element and the embossing material;
- and
- a cross-beam to which the embossing module is fixed and from which the embossing module is suspended, the cross-beam being configured to controllably move the embossing module to a position in a step-and-repeat process.
3 more elements
A method for embossing micro- and/or nanostructures in an embossing material, said method comprising:
- controllably moving an embossing element of an embossing module to remove a structured stamp of the embossing module from the embossing material in a targeted manner when the structured stamp is in contact with the embossing material and between the embossing element and the embossing material, the embossing element including at least one roller;
- and
- controllably moving the embossing module to a position in a step-and-repeat process using a cross-beam to which the embossing module is fixed and from which the embossing module is suspended.
A stamp system, comprising:
- an embossing module, comprising:
- a structured stamp configured to emboss micro- and/or nanostructures in an embossing material;
- a carrier on which the structured stamp is fixed;
- and
- an embossing element comprising at least one roller, the embossing element being configured to remove the structured stamp from the embossing material in a targeted manner when the structured stamp is in contact with the embossing material and between the embossing element and the embossing material;
- and
- a cross-beam to which the embossing module is fixed and from which the embossing module is suspended, the cross-beam being configured to controllably move the embossing module to a position in a step-and-repeat process,
- wherein the structured stamp and the carrier are configured elastically such that the structured stamp and the carrier are deformable by the embossing element.
5 more elements
Dependencies are inferred from the claim text.