Laminated body including novolac resin as peeling layer

A laminated body for cutting a plurality of chips with a redistribution layer that are fixed by a resin after peeling a support into a small number of chips, the laminated body comprising an intermediate layer that is disposed between the support and the redistribution layer having the chips fixed by the resin and peelably adheres to the support and the redistribution layer, wherein the intermediate layer includes at least a peeling layer in contact with the support, and the peeling layer contains a novolac resin that absorbs light with a wavelength of 190 nm to 600 nm incident through the support, resulting in modification;

• wherein
• the peeling layer contains a polymer (C) having the following unit structure (C1-1), (C1-2), or (C1-3), or a combination thereof
• where (C1) is a group derived from an aromatic compound having a nitrogen atom, (C2) is a group forming a secondary carbon atom, a quaternary carbon atom, or a tertiary carbon atom having an aromatic ring in a side chain, (C3) is a group derived from an aliphatic polycyclic compound, and (C4) is a group derived from phenol, bisphenol, naphthol, biphenyl, biphenol, or a combination thereof.

A laminated body for polishing a back surface of a wafer, comprising an intermediate layer that is disposed between a support and a circuit surface of the wafer and peelably adheres to the support and the circuit surface, wherein the intermediate layer includes an adhesion layer in contact with the wafer and a peeling layer in contact with the support, and the peeling layer contains a novolac resin that absorbs light with a wavelength of 190 nm to 600 nm incident through the support, resulting in modification;

• wherein the intermediate layer includes the adhesion layer containing a component (A) to be cured by a hydrosilylation reaction and a component (B) containing a polydimethylsiloxane.

A laminated body for polishing a back surface of a wafer, comprising an intermediate layer that is disposed between a support and a circuit surface of the wafer and peelably adheres to the support and the circuit surface, wherein the intermediate layer includes an adhesion layer in contact with the wafer and a peeling layer in contact with the support, and the peeling layer contains a novolac resin that absorbs light with a wavelength of 190 nm to 600 nm incident through the support, resulting in modification;

• wherein
• the intermediate layer includes the adhesion layer containing a component (A) to be cured by a hydrosilylation reaction and a component (B) containing a polydimethylsiloxane, and
• the component (B) is a polydimethylsiloxane having a viscosity of 1,000 mm2/s to 2,000,000 mm2/s.

A laminated body for polishing a back surface of a wafer, comprising an intermediate layer that is disposed between a support and a circuit surface of the wafer and peelably adheres to the support and the circuit surface, wherein the intermediate layer includes an adhesion layer in contact with the wafer and a peeling layer in contact with the support, and the peeling layer contains a novolac resin that absorbs light with a wavelength of 190 nm to 600 nm incident through the support, resulting in modification;

• wherein
• the intermediate layer includes the adhesion layer containing a component (A) to be cured by a hydrosilylation reaction and a component (B) containing a polydimethylsiloxane, and
• the component (B) is a polydimethylsiloxane having a viscosity of 10,000 mm2/s to 1,000,000 mm2/s.

A laminated body for polishing a back surface of a wafer, comprising an intermediate layer that is disposed between a support and a circuit surface of the wafer and peelably adheres to the support and the circuit surface, wherein the intermediate layer includes an adhesion layer in contact with the wafer and a peeling layer in contact with the support, and the peeling layer contains a novolac resin that absorbs light with a wavelength of 190 nm to 600 nm incident through the support, resulting in modification;

• wherein the peeling layer contains a polymer (C) having the following unit structure (C1-1), (C1-2), or (C1-3), or a combination thereof
• (where (C1) is a group derived from an aromatic compound having a nitrogen atom, (C2) is a group forming a secondary carbon atom, a quaternary carbon atom, or a tertiary carbon atom having an aromatic ring in a side chain, (C3) is a group derived from an aliphatic polycyclic compound, and (C4) is a group derived from phenol, bisphenol, naphthol, biphenyl, biphenol, or a combination thereof).