Microwave-transmitting mould structure and method for using the same
AssigneeSunko Ink Co., Ltd.
InventorsHui-Chen Chiu, Ting-Ti Huang, Ya-Chi Wang
Life of this patent
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AssigneeSunko Ink Co., Ltd.
InventorsHui-Chen Chiu, Ting-Ti Huang, Ya-Chi Wang
Estimating the term…
Disclosed is a microwave-transmitting mould structure, comprising a first template, a second template and a mould combining unit. The mould combining unit has a first snap fit, a second snap fit and an engagement member. The first snap fit is arranged on the first template; the second snap fit is arranged on the second template; and the engagement member is snap-fit engaged between the first snap fit and the second snap fit, so that when the first template and the second template are subjected to an outward pressure, corresponding faces thereof which the engagement member can pass through respectively abut against abutting faces of the first snap fit and of the second snap fit, and thus, the first template and the second template cannot be separated from each other due to an increased pressure inside the mould.
A microwave-transmitting mould structure, comprising:
Dependencies are inferred from the claim text.