Electronic device including bonded parts and method for detecting the same

A method for detecting an electronic device including bonded parts, wherein the electronic device comprises:

• a first part, wherein the first part comprises a first bonding area, the first bonding area comprises at least one first testing area, the first testing area comprises a first testing pad, a second testing pad and a third testing pad, and the first testing pad is electrically connected with the second testing pad and the third testing pad;
• and
• a second part, wherein the second part comprises a second bonding area corresponding to the first bonding area, the second bonding area comprises a first testing terminal, a second testing terminal, a third testing terminal and a fourth testing terminal, the second bonding area also comprises at least one second testing area respectively corresponding to the at least one first testing area, and the second testing area comprises a first testing pin, a second testing pin and a third testing pin,
• wherein the first testing pad is bonded with the first testing pin, the second testing pad is bonded with the second testing pin, the third testing pad is bonded with the third testing pin, and
• wherein, the first testing pin is electrically connected with the first testing terminal and the second testing terminal, the second testing pin is electrically connected with the third testing terminal, the third testing pin is electrically connected with the fourth testing terminal, and
• wherein the method comprises:
• applying a first constant current signal through the first testing terminal and the third testing terminal, or through the second testing terminal and the fourth testing terminal, or through the first testing terminal and the fourth testing terminal, or through the second testing terminal and the third testing terminal;
• obtaining a first test voltage from two testing terminals selected from the first testing terminal, the second testing terminal, the third testing terminal and the fourth testing terminal of the second bonding area, which are not used for applying the first constant current signal;
• determining a first test resistance based on the first test voltage and the first constant current signal;
• and
• determining whether the first test resistance meets a first preset resistance threshold.