Metal particle-containing composition and electrically conductive adhesive film

A metal particle-containing composition comprising:

• at least one thermosetting resin (R);
• a hardening agent (H);
• and
• at least three types of metal particles (P) different from one another, wherein
• the metal particles (P) contain:
• a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower;
• at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1);
• at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with the metal (A) contained in the solder alloy particle (P1);
• the thermosetting resin (R) is a maleic acid imide resin;
• the hardening agent (H) is a radical generating agent;
• the metal (C) is nickel;
• and
• a particle diameter (d50) of primary particles of the metal particle (P3) is 1 μm or less.