Bonding device and bonding method
AssigneesChengdu Boe Optoelectronics Technology Co., Ltd., Beijing BOE Technology Development Co., Ltd.
InventorsFei Zeng, Jialin Wang, Jia Deng, Chaoxue Qin, Haitao Liang, Zhibing Lin, Guodong Zhou
Life of this patent
Estimating the term…