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US 11,464,118 B2Granted
Method for manufacturing electronic device
AssigneePCI Private Limited
InventorsHandi Kartadihardja, Nelson Ranola, Chi Wei Yap, Stephen Conner
Life of this patent
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Abstract
Methods for manufacturing an electronic device include providing a substrate having a plurality of radio-frequency components provided thereon, the radio-frequency components including an antenna and a matching circuitry. A cap is attached to the substrate over the antenna and the matching circuitry and a molding operation is performed to encapsulate the cap and at least a portion of the substrate with a mold compound.
Claims11
A method for manufacturing an electronic device, comprising:
- providing a substrate having a plurality of radio-frequency components provided thereon, the radio-frequency components comprising an antenna and a matching circuitry;
- attaching a cap to the substrate over the antenna and the matching circuitry to provide a sealed environment for electronics within to operate;
- and
- performing a molding operation to encapsulate the cap and at least a portion of the substrate with a mold compound.
1 more element
Dependencies are inferred from the claim text.