Wiring substrate
AssigneeKYOCERA Corporation
InventorKeizou Sakurai
Life of this patent
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Abstract
A wiring substrate comprises a first substrate, a second substrate which includes a frame body located on the outer circumferential edge of the first substrate, at least two connecting parts connected to the inner circumferential part of the frame body, and a support body connecting the two connecting parts to each other, and a third substrate located on a surface of the second substrate opposite the first substrate. The support body includes a direction changing part between the two connecting parts and does not include an annular structure where the direction changing part is included on the circumference.
Claims19
A wiring substrate comprising:
- a first substrate,
- a second substrate which is located on one side of the first substrate, comprising a frame body located on an outer circumferential edge of the first substrate, at least two connecting parts connected to an inner circumferential part of the frame body, and a support body connecting the two connecting parts to each other, and
- a third substrate which is located on a surface of the second substrate opposite to the first substrate,
- wherein the frame body is fixed on the first substrate and the third substrate,
- wherein the support body includes a thermosetting resin and a direction changing part which is a bending point between the two connecting parts, and
- wherein a space is located between the support body and the first substrate and between the support body and the third substrate.
Dependencies are inferred from the claim text.