Printed circuit board including ground line for canceling electromagnetic waves generated by power line, and electronic device including same
AssigneeSamsung Electronics Co., Ltd.
InventorJaewoong Jeon
Life of this patent
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Abstract
A printed circuit board according to various embodiments of the present disclosure can include a first substrate layer, a dielectric layer stacked below the first substrate layer, and a second substrate layer stacked below the dielectric layer. The second substrate layer can include: a power line; a ground part disposed to have an isolated area along the power line; and a ground line which extends from the ground part so as to be disposed in the isolated area, and which separates the isolated area into a first area and a second area so as to generate electromagnetic waves for canceling the electromagnetic waves generated by a current flowing through the power line. Other embodiments are also possible.
Claims15
A printed circuit board (PCB) comprising:
- a first substrate layer;
- a dielectric layer disposed under the first substrate layer;
- and
- a second substrate layer composed of a conductive material and disposed under the dielectric layer, the second substrate layer including:
- a first slit formed as surrounding a first area of the second substrate layer such that the first area surrounded by the first slit is to operate as a power line area to which a power load is to be electrically connected;
- and
- a second slit formed as surrounding a first portion of the first slit and not a second portion of the first slit such that a second area of the second substrate layer between the second slit and the first portion of the first slit is to operate as a ground line, and that a third area of the second substrate layer outwardly adjacent to the second portion of the first slit is to operate as a ground area.
An electronic device, comprising:
- a housing;
- a printed circuit board (PCB) including a plurality of conductive layers and at least one dielectric layer alternately stacked one above another;
- an electronic component mounted on the PCB;
- and
- a battery disposed adjacent to the PCB, the PCB comprising:
- a first substrate layer;
- a dielectric layer disposed under the first substrate layer;
- and
- a second substrate layer composed of a conductive material and disposed under the dielectric layer, the second substrate layer including:
- a first slit formed as surrounding a first area of the second substrate layer such that the first area surrounded by the first slit is to operate as a power line area to which a power load is to be electrically connected;
- and
- a second slit formed as surrounding a first portion of the first slit and not a second portion of the first slit such that a second area of the second substrate layer between the second slit and the first portion of the first slit is to operate as a ground line, and that a third area of the second substrate layer outwardly adjacent to the second portion of the first slit is to operate as a ground area.
Dependencies are inferred from the claim text.