Wiring substrate and current measuring device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorShinji Oshima
Life of this patent
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Abstract
A wiring substrate includes an insulating body; a first conductor including a first shield layer provided in a first layer inside the insulating body, and a second shield layer provided in a second layer at a different position from the first layer in a thickness direction of the insulating body; a second conductor including a first guard layer provided in a third layer positioned between the first layer and the second layer in the thickness direction, and a second guard layer provided in a fourth layer positioned between the second layer and the third layer in the thickness direction; and a third conductor provided in a fifth layer positioned between the third layer and the fourth layer in the thickness direction.
Claims16
A wiring substrate, comprising:
- an insulating body;
- a first conductor including
- a first shield layer provided in a first layer inside the insulating body, and
- a second shield layer provided in a second layer at a different position from the first layer in a thickness direction of the insulating body;
- a second conductor including
- a first guard layer provided in a third layer positioned between the first layer and the second layer in the thickness direction, and
- a second guard layer provided in a fourth layer positioned between the second layer and the third layer in the thickness direction;
- and
- a third conductor provided in a fifth layer positioned between the third layer and the fourth layer in the thickness direction.
Dependencies are inferred from the claim text.