Interconnect structure having conductor extending along dielectric block
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJiun-Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh
Life of this patent
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Abstract
An interconnect structure includes a substrate, a dielectric block, and a conductor. The dielectric block is in the substrate. A dielectric constant of the dielectric block is smaller than a dielectric constant of the substrate, and the dielectric block and the substrate have substantially the same thickness. The conductor includes a first portion extending from a top surface to a bottom surface of the dielectric block and a second portion extending along and contacting the top surface of the dielectric block.
Claims20
An interconnect structure, comprising:
- a substrate, wherein the substrate is a single piece of continuous material;
- a dielectric block in the substrate, wherein a dielectric constant of the dielectric block is smaller than a dielectric constant of the substrate, and the dielectric block and the substrate have substantially the same thickness, wherein a top surface of the dielectric block is coplanar with a top surface of the substrate;
- and
- a conductor comprising a first portion extending from the top surface to a bottom surface of the dielectric block and a second portion extending along and contacting the top surface of the dielectric block.
An interconnect structure, comprising:
- a substrate;
- a dielectric block in the substrate;
- a shielding element laterally surrounding the dielectric block, wherein the shielding element comprises a first portion extending along an outer sidewall of the dielectric block and a second portion extending along a bottom surface of the substrate;
- and
- a conductor comprising a first portion extending from a top surface to a bottom surface of the dielectric block and a second portion extending along the bottom surface of the dielectric block, wherein the shielding element and the conductor have substantially the same height, and an interface between the second portion of the shielding element and the substrate is coplanar with an interface between the second portion of the conductor and the dielectric block.
An interconnect structure, comprising:
- a substrate;
- a low-k dielectric block in the substrate;
- a first conductor extending from a top surface to a bottom surface of the low-k dielectric block;
- a plug laterally surrounded by the first conductor;
- and
- a dielectric layer over and contacting the substrate and the low-k dielectric block, over a top surface of the first conductor, and spaced apart from the plug.
Dependencies are inferred from the claim text.