Radio-frequency module and communication device

A communication device comprising:

• a signal processing circuit that processes radio-frequency signals;
• and
• a radio-frequency module that transmits the radio-frequency signals between the signal processing circuit and an antenna, wherein
• the radio-frequency module includes
• a module substrate having a first main surface and a second main surface on opposite sides of the module substrate;
• a resin member that covers at least a portion of the second main surface and includes a first recess and a second recess;
• a plurality of external connection terminals that include a first external connection terminal and a second external connection terminal, that are arranged on the second main surface, and that penetrate through the resin member;
• and
• a semiconductor component that is arranged between the first external connection terminal and the second external connection terminal on the second main surface and that includes a surface that is not covered by the resin member, wherein
• the first recess is arranged between the first external connection terminal and the semiconductor component, and
• the second recess is arranged between the second external connection terminal and the semiconductor component.

A radio-frequency module comprising:

• a module substrate having a first main surface and a second main surface on opposite sides of the module substrate;
• a resin member that covers at least a portion of the second main surface and includes a first recess and a second recess;
• a first external connection terminal arranged on the second main surface and that penetrates through the resin member;
• a second external connection terminal arranged on the second main surface and that penetrates through the resin member;
• a semiconductor component that is arranged between the first external connection terminal and the second external connection terminal on the second main surface, wherein
• the first recess is arranged between the first external connection terminal and the semiconductor component, and
• the second recess is arranged between the second external connection terminal and the semiconductor component.