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US 11,456,516 B2Granted
Low loss high-speed interconnects
AssigneeIntel Corporation
InventorsLing Li Ong, Kin Wai Lee, Bok Eng Cheah, Yang Liang Poh, Yean Ling Soon
Life of this patent
Estimating the term…
Abstract
An electronic device and associated methods are disclosed. In one example, the electronic device can include an assembly having asymmetrically situated conductors. In selected examples, the assembly includes a ground plane, a central shield portion, a first side shield portion on a first side, a second side shield portion on a second side, a first conductor asymmetrically situated between the central shield portion and the first side shield portion, a second conductor asymmetrically situated between the central shield portion and the second side shield portion, and dielectric within the assembly.
Claims19
An assembly, comprising:
- a ground plane on a bottom surface;
- a top surface opposite the bottom surface;
- a central shield portion extending between the bottom surface and the top surface, the central shield portion comprising:
- one or more central reference layers parallel the ground plane;
- and
- one or more a via vertically coupling together the one or more central reference layers;
- a first side shield portion on a first side of the assembly, spaced apart from the central shield portion by a first gap, the first side shield portion comprising:
- one or more first side reference layers parallel the ground plane;
- and
- one or more via vertically coupling together the one or more first side reference layers;
- a second side shield portion on a second side of the assembly, spaced apart from the central shield portion by a second gap, the second side shield portion comprising:
- one or more second side reference layers parallel the ground plane;
- and
- one or more via vertically coupling together the one or more second side reference layers;
- a first conductor situated laterally asymmetric in the first gap;
- a second conductor situated laterally asymmetric in the second gap, wherein first conductor and the second conductor carry complementary electrical signals;
- and
- dielectric interspersed in and around the central shield portion, the first side shield portion, and the second side portion, the dielectric extending from the top surface to the bottom surface.
15 more elements
An electronic device, comprising:
- an assembly comprising:
- a ground plane;
- a shield comprising:
- a central portion;
- a first side portion;
- and
- a second side portion, the central portion situated between the first side portion and the second side portion;
- a differential pair comprising first and second conductors, the first conductor situated laterally asymmetric between the central portion and the first side portion, the second conductor situated laterally asymmetric between the central portion and the second side portion;
- a signal transmitter;
- a signal receiver, the assembly for connecting the signal transmitter to the signal receiver, and conveying a signal from the signal transmitter to the signal receiver.
7 more elements
An assembly, comprising:
- a ground plane on a bottom surface;
- a top surface opposite the bottom surface;
- a central shield portion extending between the bottom surface and the top surface, the central shield portion comprising:
- one or more central reference layers parallel the ground plane;
- and
- one or more a via vertically coupling together the one or more central reference layers;
- a first side shield portion on a first side of the assembly, spaced apart from the central shield portion by a first gap, the first side shield portion comprising:
- one or more first side reference layers parallel the ground plane;
- and
- one or more via vertically coupling together the one or more first side reference layers;
- a second side shield portion on a second side of the assembly, spaced apart from the central shield portion by a second gap, the second side shield portion comprising:
- one or more second side reference layers parallel the ground plane;
- and
- one or more via vertically coupling together the one or more second side reference layers;
- a first conductor situated laterally asymmetric in the first gap;
- a second conductor situated laterally asymmetric in the second gap wherein the ratio of the distance from the first conductor to the central shield portion compared to the distance from the first conductor to the first side shield portion is about 1:1.5 to about 1:10;
- and
- dielectric interspersed in and around the central shield portion, the first side shield portion, and the second side portion, the dielectric extending from the top surface to the bottom surface.
15 more elements
Dependencies are inferred from the claim text.