Chip bonding region of a carrier of light emitting package and manufacturing method thereof

A manufacturing method of a light emitting package, comprising:

• a preparation step implemented by preparing a carrier, wherein the carrier includes at least one hollow-out structure and at least one chip bonding region formed within the at least one hollow-out structure, wherein portions of two neighboring conductive parts in the at least one chip bonding region are respectively exposed from a bottom portion the at least one hollow-out structure and defined as the at least one chip bonding region;
• a chip bonding step implemented by disposing at least one light emitting chip onto the at least one chip bonding region, wherein two electrodes of the light emitting chip are respectively mounted onto the two neighboring conductive parts through a bonding material;
• and
• a sealing step implemented by disposing a sealant onto the carrier and covering at least one light emitting chip so as forming a underfill between the bottom portion of the at least one hollow-out structure and the at least one light emitting chip;
• wherein the carrier has a main part and the preparation step includes a first coating procedure and a second coating procedure, wherein the first coating procedure is implemented by disposing a first coating layer on the main part, and the tops of the two neighboring conductive parts are exposed from a top of the first coating layer, and wherein the second coating procedure is implemented by disposing a second coating layer onto the top of the first coating layer and portions of the tops of the two neighboring conductive parts for forming the at least one hollow-out structure by the second coating layer.

A light emitting package, comprising:

• a carrier, including:
• a main part having at least one chip bonding region;
• at least two conductive parts disposed on the at least one chip bonding region;
• an insulating part disposed on the main part, wherein a top of the insulating part is higher than tops of the at least two conductive parts;
• and
• at least one hollow-out structure formed at a portion of the insulating part corresponding in position to the at least one chip bonding region, wherein the at least one hollow-out structure has a side wall and a bottom portion, the side wall surrounds the at least one chip bonding region, and portions of the tops of the at least two conductive parts are exposed from the bottom portion, and the tops of the at least two conductive parts corresponding in position to the at least one hollow-out structure are defined as the at least one chip bonding region;
• wherein the insulating part includes a first coating and a second coating, a top of the first coating is flush with the tops of the at least two conductive parts, the at least one hollow-out structure is formed in the second coating, and the bottom portion of the at least one hollow-out structure is formed on the top of the first coating;
• at least one light emitting chip is bonded onto the at least one chip bonding region and electrically connected with the exposed portions of the at least two neighboring conductive parts through a bonding layer;
• wherein the second coating is in contact with the bonding layer.