Optoelectronic semiconductor chip
AssigneeOSRAM OLED GmbH
InventorsRoland Heinrich Enzmann, Lorenzo Zini, Vanessa Eichinger, Stefan Barthel
Life of this patent
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Abstract
An optoelectronic semiconductor chip may include a semiconductor body, a first and second contact element, a chip carrier, an electrically conductive contact layer, an electrically conductive supply layer, an insulating layer between the contact layer and the supply layer, and at least one electrically conductive feed-through element embedded in the insulating layer. The feed-through element(s) may electrically connect the supply layer to the contact layer. A quantity and/or size of the feed-through elements may be greater on a second side of the semiconductor body opposite to the first side than on the first side.
Claims18
An optoelectronic semiconductor chip comprising:
- a semiconductor body comprising a first semiconductor region and a second semiconductor region;
- a first and second contact element configured to electrically contact the semiconductor body;
- a chip carrier where the semiconductor body and the first contact element and the second contact element are arranged thereon;
- wherein the semiconductor body and the first contact element and the second contact element are arranged next to each other, the first contact element and the second contact element being arranged on a first side of the semiconductor body;
- an electrically conducting contact layer arranged on a first main surface of the semiconductor body, said first main surface facing the chip carrier;
- an electrically conducting supply layer arranged on the side of the electrically conducting contact layer facing away from the semiconductor body;
- wherein the electrically conducting supply layer is connected to the first contact element;
- an insulation layer arranged between the electrically conducting contact layer and the electrically conducting supply layer;
- wherein the insulation layer electrically insulates the electrically conducting contact layer from the electrically conducting supply layer;
- and
- at least one electrically conductive feed-through element embedded in the insulation layer and electrically connecting the electrically conducting supply layer to the electrically conducting contact layer, wherein a quantity and/or size of the at least one electrically conductive feed-through elements is greater on a second side of the semiconductor body opposite the first side than on the first side, wherein the at least one electrically conductive feed-through element comprises a same material as the electrically conductive supply layer.
Dependencies are inferred from the claim text.