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US 11,456,401 B2Granted
Light emitting diode package
AssigneeSeoul Semiconductor Co., Ltd.
InventorsSeung Sik Hong, Motonobu Takeya
Life of this patent
Estimating the term…
Abstract
A light emitting diode package including a light emitting diode chip, a phosphor layer disposed to cover an upper portion of the light emitting diode chip, the phosphor layer being configured to convert a wavelength of light emitted from the light emitting diode chip, and a color filter layer disposed to cover an upper portion of the phosphor layer, the color filter being configured to block light having a predetermined wavelength range from being emitted through the phosphor layer.
Claims18
A light emitting diode package comprising:
- a light emitting diode chip configured to emit light having a peak wavelength;
- a phosphor layer disposed to cover an upper portion of the light emitting diode chip, the phosphor layer being configured to convert a wavelength of light emitted from the light emitting diode chip;
- and
- a color filter layer disposed to cover an upper portion of the phosphor layer, the color filter layer being configured to block light emitted from the light emitting diode chip that has the peak wavelength from being emitted through the phosphor layer and transmit light having a wavelength longer than the peak wavelength,
- wherein the phosphor layer is disposed to cover side surfaces and the upper portion of the light emitting diode chip, and
- wherein the color filter layer is disposed to cover side surfaces and the upper portion of the phosphor layer.
3 more elements
A method of forming a light emitting diode package, comprising:
- providing a light emitting diode chip having a peak wavelength on a substrate;
- disposing a liquid comprising a phosphor on the light emitting diode chip and curing the liquid to form a phosphor layer configured to convert a wavelength of light emitted from the light emitting diode chip;
- and
- forming a color filter layer on the phosphor layer by a spin coating method to block light having the peak wavelength from being emitted through the phosphor layer and transmit light having a wavelength longer than the peak wavelength,
- wherein the phosphor layer is disposed to cover side surfaces and the upper portion of the light emitting diode chip, and
- wherein the color filter layer is disposed to cover side surfaces and the upper portion of the phosphor layer.
3 more elements
Dependencies are inferred from the claim text.