Stack chip air gap heat insulator
AssigneeOmniVision Technologies, Inc.
InventorSing-Chung Hu
Life of this patent
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Abstract
Image sensors include a pixel die that is stacked on a logic die. The logic die includes at least one function logic element disposed on a bond side thereof, and a logic oxide array of raised logic oxide features also disposed on the bond side. The pixel die includes a pixel array disposed on a light receiving side thereof, and a pixel oxide array of raised pixel oxide features disposed on a bond side of the pixel die. A plurality of outer bonds is disposed between an outer region of the logic die and an outer region of the pixel die. A plurality of inner bonds is formed at an inner region of the image sensor between the pixel oxide array and the logic oxide array, the inner bonds being spaced apart by a plurality of fluidly connected air gaps that extend between the logic die and the pixel die.
Claims13
An image sensor, comprising:
- a logic die, comprising:
- a function logic element disposed on a bond side of the logic die;
- and
- a logic oxide array of raised logic oxide features disposed on the bond side of the logic die;
- a pixel die stacked on top of the logic die, the pixel die comprising:
- a pixel array disposed on a light receiving side of the pixel die;
- and
- a pixel oxide array of raised pixel oxide features disposed on a bond side of the pixel die;
- a plurality of outer bonds disposed between an outer region of the logic die and an outer region of the pixel die;
- and
- a plurality of inner bonds formed at an inner region of the image sensor between the pixel oxide array and the logic oxide array, the inner bonds being spaced apart by a plurality of fluidly connected air gaps extending between the logic die and the pixel die,
- wherein the raised logic oxide features form a logic oxide grid and the raised pixel oxide features form a pixel oxide grid that overlaps the logic oxide grid by an inner bond overlap amount,
- wherein adjacent raised pixel oxide features are spaced apart by a pitch P of about 10 μm to about 50 μm and are offset from the raised logic oxide features.
An image sensor, comprising:
- a logic die, comprising:
- a function logic element disposed on a bond side of the logic die;
- and a logic oxide array of raised logic oxide features disposed on the bond side of the logic die;
- a pixel die stacked on top of the logic die, the pixel die comprising:
- a pixel array disposed on a light receiving side of the pixel die;
- and a pixel oxide array of raised pixel oxide features disposed on a bond side of the pixel die;
- a plurality of outer bonds disposed between an outer region of the logic die and an outer region of the pixel die;
- and a plurality of inner bonds formed at an inner region of the image sensor between the pixel oxide array and the logic oxide array, the inner bonds being spaced apart by a plurality of fluidly connected air gaps extending between the logic die and the pixel die, wherein each fluidly connected air gap has a depth G measured between the logic die and the pixel die of about 1 μm to about 3 μm, each fluidly connected air gap is fluidly connected with at least one air channel located between adjacent outer bonds, the at least one air channel having a width of about 150 μm to about 2000 μm, wherein each raised logic oxide feature and each raised pixel oxide feature has a width W of about 2 μm to about 5 μm, adjacent raised pixel oxide features are spaced apart by a pitch P of about 10 μm to about 50 μm, and wherein the raised pixel oxide features are offset from the raised logic oxide features by an offset angle α of about 15 degrees to about 75 degrees and by an offset length L of about 25% of the pitch P to about 75% of the pitch P.
Dependencies are inferred from the claim text.