Imaging device, method for manufacturing imaging device, and electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorsNaoyuki Sato, Eriko Ohtsu
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AssigneeSony Semiconductor Solutions Corporation
InventorsNaoyuki Sato, Eriko Ohtsu
Estimating the term…
The present disclosure relates to an imaging device, a method for manufacturing an imaging device, and an electronic device capable of reducing light entering an electric-charge holding unit in a back-illuminated imaging device. An imaging device includes: a photoelectric conversion unit; an electric-charge holding unit; a semiconductor substrate; a wiring layer; an insulation film layer; a first light-shielding film; and a second light-shielding film. The insulation film layer, the first light-shielding film, and the wiring layer are stacked on a second surface of the semiconductor substrate. The second light-shielding film includes: a first light-shielding portion extending from the first surface of the semiconductor substrate to a middle of the semiconductor substrate; a second light-shielding portion penetrating the semiconductor substrate; and a third light-shielding portion covering a part of the first surface of the semiconductor substrate. The present technology is applicable to a CMOS image sensor, for example.
An imaging device, comprising:
An electronic device, comprising:
Dependencies are inferred from the claim text.