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US 11,456,323 B2Granted
Imaging unit
AssigneeSony Semiconductor Solutions Corporation
InventorKoichi Sejima
Life of this patent
Estimating the term…
Abstract
An imaging unit including first semiconductor substrate that includes a photoelectric converter, a heat conductive wiring line provided in contact with the first semiconductor substrate, and a cooling device that controls a temperature of the photoelectric converter via the heat conductive wiring line.
Claims15
An imaging unit, comprising:
- a first semiconductor substrate including a photoelectric converter;
- a second semiconductor substrate stacked on the first semiconductor substrate, wherein the second semiconductor substrate is electrically coupled to the first semiconductor substrate;
- a heat conductive wiring line in contact with the first semiconductor substrate;
- and
- a cooling device configured to a temperature of the photoelectric converter via the heat conductive wiring line, wherein
- the cooling device is opposite to the first semiconductor substrate, and
- the second semiconductor substrate is between the cooling device and the first semiconductor substrate.
4 more elements
An imaging unit, comprising:
- a first semiconductor substrate that includes a light receiving region and a peripheral region, wherein
- the light receiving region includes a photoelectric converter, and
- the peripheral region is outside the light receiving region;
- a heat conductive wiring line in contact with the first semiconductor substrate;
- and
- a cooling device configured to control a temperature of the photoelectric converter via the heat conductive wiring line, wherein
- the cooling device is in peripheral region,
- the cooling device includes a P-type semiconductor portion, an N-type semiconductor portion, and a metal portion,
- the P-type semiconductor portion and the N-type semiconductor portion is in the first semiconductor substrate, and
- the metal portion is between the P-type semiconductor portion and the N-type semiconductor portion.
7 more elements
Dependencies are inferred from the claim text.