Face-to-face semiconductor device with fan-out porch

A semiconductor device assembly comprising:

• a substrate having a first side, a second side opposite the first side, and a substrate contact on the first side;
• a first semiconductor device on the first side of the substrate, the first semiconductor device comprising —
• an active side having a first bond pad;
• and
• a back side opposite the active side and facing the first side of the substrate;
• a second semiconductor device comprising —
• an active side having a second bond pad and facing the active side of the first semiconductor device;
• and
• a back side opposite the active side;
• a conductive connector operably coupling the first bond pad to the second bond pad;
• a fan-out porch formed separately from the first semiconductor device on the substrate and positioned adjacent a lateral side of the first semiconductor device;
• a wirebond contact on the fan-out porch electrically coupled to the first semiconductor device, the wirebond contact positioned outside of a footprint of the second semiconductor device as observed normal to the active side of the first semiconductor device;
• and
• a wirebond connecting the wirebond contact to the substrate contact.