Package structure and method of fabricating the same

A package structure, comprising:

• a circuit substrate;
• an interposer structure disposed on the circuit substrate and electrically connected to the circuit substrate;
• a plurality of semiconductor dies disposed on the interposer structure and electrically connected to the interposer structure;
• a lid structure disposed on the circuit substrate and surrounding the interposer structure and the plurality of semiconductor dies, wherein the lid structure is attached to the circuit substrate through an adhesive material;
• first passive device and a second passive device disposed on the circuit substrate in between the interposer structure and the lid structure, wherein the first passive device and the second passive device respectively comprises a first surface that faces the lid structure, a second surface opposite to the first surface that faces the interposer structure, a third surface joining the first surface to the second surface, and a fourth surface opposite to the third surface and joining the first surface to the second surface;
• and
• a plurality of barrier structures disposed on the circuit substrate in between the interposer structure and the lid structure, wherein the plurality of barrier structures comprises:
• a first dam portion disposed in between the first surface of the first passive device and the lid structure, and in between the first surface of the second passive device and the lid structure;
• and
• a ring-shaped second dam portion disposed in between the first dam portion and the interposer structure, wherein the ring-shaped second dam portion encircles only the first passive device, and is physically separated from the first passive device.

A method of fabricating a package structure, comprising:

• disposing a semiconductor package onto a circuit substrate;
• forming an underfill structure disposed in between the circuit substrate and the semiconductor package;
• disposing a first passive device on the circuit substrate adjacent to a first side of the semiconductor package;
• disposing a second passive device on the circuit substrate adjacent to a second side of the semiconductor package, wherein the second side is opposite to the first side;
• forming a barrier structure comprising:
• dispensing a polymer ink material on the circuit substrate adjacent to the first passive device, and curing the polymer ink material to form a first dam portion extending along a first direction;
• dispensing the polymer ink material on the circuit substrate adjacent to the second passive device, and curing the polymer ink material to form an auxiliary first dam portion physically separated from the first dam portion, and non-overlapped with the first dam portion along the first direction, wherein the auxiliary first dam portion includes a first section, a second section and a third section, the first section and the second section surround two opposing side surfaces of the second passive device, the third section physically joins the first section to the second section and surrounds a third side surface of the second passive device, and the auxiliary first dam portion uncovers a fourth side surface of the second passive device that is facing the second side of the semiconductor package, and wherein disconnected ends of the first section and the second section include end terminal surfaces that are facing the underfill structure;
• and
• attaching a lid structure on the circuit substrate through an adhesive material so that the first passive device is disposed in between the first side of the semiconductor package and the lid structure, and the second passive device is disposed in between the second side of the semiconductor package and the lid structure, wherein the first dam portion is separating the first passive device from the lid structure and the adhesive material, and is in physical contact with the adhesive material, and wherein the auxiliary first dam portion is separating the second passive device from the lid structure and the adhesive material, and is in physical contact with the adhesive material.