Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods

A semiconductor device assembly, comprising:

• an encapsulant including an outer surface;
• a semiconductor device at least partially encased within the encapsulant and having an active surface, a lower surface, and a through substrate via electrically connecting the active surface to the lower surface;
• and
• an interconnect attached to the active surface of the semiconductor device, wherein at least a portion of the interconnect is vertically aligned with the active surface of the semiconductor device and extends beyond the outer surface of the encapsulant, and wherein the interconnect includes a contact surface electrically connected to the active surface of the semiconductor device.

A semiconductor device assembly having a first longitudinal side and a second longitudinal side, the semiconductor device assembly comprising:

• a support substrate;
• an encapsulant including an outer surface;
• a first semiconductor die carried by the support substrate and encased within the encapsulant;
• a second semiconductor die carried by the first semiconductor die and at least partially encased within the encapsulant, the second semiconductor die having an active surface and a redistribution network at the active surface, wherein the active surface includes a bond pad on the first longitudinal side, and wherein the active surface has a longitudinal footprint;
• a first interconnect attached to the active surface of the second semiconductor die on the first longitudinal side, wherein at least a portion of the first interconnect extends beyond the outer surface of the encapsulant within the longitudinal footprint of the active surface, and wherein the first interconnect is electrically coupled to the bond pad through the redistribution network;
• and
• a second interconnect attached to the active surface of the second semiconductor die on the second longitudinal side, wherein at least a portion of the second interconnect extends beyond the outer surface of the encapsulant, and wherein the second interconnect is electrically coupled to the bond pad through the redistribution network.