Semiconductor device and method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, the method comprising:

• preparing a substrate including an insulating layer and a plurality of circuit patterns formed on the insulating layer, setting an element region on a principal surface of the substrate;
• preparing a plurality of main terminals, and a plurality of control terminals;
• disposing a first end of each of the plurality of main terminals in one of the plurality of circuit patterns in the element region, so that a second end of each of the plurality of main terminals extends out of the substrate from a first side of the substrate;
• disposing the plurality of control terminals in a control region that is adjacent to a second side of the substrate opposite the first side;
• directly bonding the first ends of the plurality of main terminals disposed in the plurality of circuit patterns of the substrate to the plurality of circuit patterns;
• sealing the principal surface and the control region with a sealing member, wherein
• the substrate prepared at the step of preparing a substrate further includes a fixing pattern formed together with the plurality of circuit patterns on the insulating layer, and
• the method further includes:
• preparing a hanger terminal,
• disposing one end of the hanger terminal on the fixing pattern, and
• joining the one end of the hanger terminal to the fixing pattern.

A semiconductor device, comprising:

• a substrate including an insulating layer and a plurality of circuit patterns formed on the insulating layer, the substrate having a principal surface on which an element region is set, the substrate having first to fourth sides to define an outer periphery thereof, the second side being opposite to the first side, the third side being perpendicular to the first and second sides, the fourth sides being perpendicular to the first and second sides and being opposite to the third side;
• a plurality of semiconductor elements provided on the plurality of circuit patterns in the element region;
• a plurality of main terminals that each have a first end bonded to one of the plurality of circuit patterns in the element region and a second end extending out of the substrate from the first side of the substrate;
• a plurality of control terminals disposed in a control region that is adjacent to the second side of the substrate;
• a sealing member that seals the principal surface and the control region;
• a fixing pattern formed on the insulating layer of the substrate;
• and
• a hanger terminal having a first end and a second end, the first end thereof being fixed to the fixing pattern and being sealed by the sealing member, wherein the sealing member has
• a first side surface that corresponds to the first side of the substrate,
• a second side surface that corresponds to the second side of the substrate,
• a third side surface that corresponds to the third side of the substrate, and
• a fourth side surface that corresponds to the fourth side of the substrate,
• each of the plurality of main terminals extends from the first side surface of the sealing member,
• each of the plurality of control terminals extends from the second side surface of the sealing member, and
• the hanger terminal is sealed by the sealing member, with the second end thereof exposed from the third side surface or the fourth side surface of the sealing member.