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US 11,456,284 B2Granted
Microelectronic device assemblies and packages and related methods
AssigneeMicron Technology, Inc.
InventorsRandon K. Richards, Aparna U. Limaye, Owen R. Fay, Dong Soon Lim
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Abstract
Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.
Claims18
A microelectronic device assembly, comprising:
- a microelectronic device having an active surface facing a substrate;
- a single conductive material extending through each of a number of holes in a single, preformed dielectric film in direct contact with the active surface of the microelectronic device and the substrate, the single conductive material in the number of holes in contact with an array of bond pads on the active surface of the microelectronic device and terminal pads on the substrate;
- and
- a stack of additional microelectronic devices on the microelectronic device, each additional microelectronic device having a separate, preformed dielectric film extending over a surface thereof and beyond at least one side of the stack of additional microelectronic devices, the separate, preformed dielectric films each carrying conductive traces extending from bond pads on the surfaces of the additional microelectronic devices to and in contact with conductive material-filled vias in the separate, preformed dielectric films located beyond the at least one side of the stack of additional microelectronic devices and extending to terminal pads on the substrate.
1 more element
A microelectronic device assembly comprising:
- a stack of microelectronic devices on a substrate, each microelectronic device comprising TSVs extending through a thickness thereof between bond pads on an active surface and terminal pads on a back side thereof;
- and
- preformed, discrete dielectric films interposed between and in direct contact with adjacent microelectronic devices of the stack, the preformed, discrete dielectric films comprising holes extending therethrough and aligned between bond pads and terminal pads of adjacent microelectronic devices of the stack, the holes filled with a single conductive material in contact with aligned bond pads and terminal pads of adjacent microelectronic components.
A method comprising:
- forming a reconstructed wafer or panel by placing singulated semiconductor dice in mutually spaced relationship and laminating a polymer film over active surfaces of the singulated semiconductor dice comprising bond pads;
- forming via holes through the polymer film to expose bond pads on the active surfaces;
- filling the via holes with conductive material;
- singulating the semiconductor dice of the reconstructed panel or wafer through the polymer film;
- inverting at least one semiconductor die and placing the inverted at least one semiconductor die on a substrate with conductive material-filled via holes aligned with terminal pads on the substrate;
- and
- bonding the polymer film to the substrate with the conductive material in contact with the terminal pads.
4 more elements
Dependencies are inferred from the claim text.