Thermocompression bonding of electronic components

A method for producing an electronic module, the method comprising:

• providing a first substrate including at least one first electrical contacting surface, an electronic component including at least one second electrical contacting surface, and a first material layer made of a thermoplastic material having at least one recess extending through the first material layer;
• arranging the first substrate, the electronic component and the first material layer to place the first material layer between the first substrate and the electronic component, and to align the at least one first electrical contacting surface, the at least one second electrical contacting surface and the at least one recess relative to one another;
• placing a second material layer, cover film, or second substrate made of a thermoplastic material on the electronic component;
• thermocompression bonding the first substrate, the electronic component, the first material layer, and the second material layer to form a joint between the at least one first electrical contacting surface and the at least one second electrical contacting surface, and to surround or enclose the joint with the first material layer;
• and
• forming the first substrate of a first thermoplastic polymer, forming the first material layer of a second thermoplastic polymer, and providing the first thermoplastic polymer with at least one of a higher glass transition temperature or a higher melting temperature than the second thermoplastic material.