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US 11,456,275 B2Granted
Semiconductor device and method of manufacturing semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorKazuo Enomoto
Life of this patent
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Abstract
A semiconductor device includes an insulated circuit board in which a metal layer is formed on one surface of an insulating board and a semiconductor element having a polygonal shape when viewed in a plan view that is bonded to the metal layer via a bonding material. The metal layer of the insulated circuit board has a recess that exposes the insulating board at a position corresponding to at least one corner of the semiconductor element.
Claims9
A semiconductor device, comprising:
- an insulated circuit board including an insulating board and a metal layer on the insulating board;
- and
- a semiconductor element mounted on the metal layer via a bonding material that covers a substantially entire back surface of the semiconductor element, the semiconductor element having a polygonal shape when viewed in a plan view,
- wherein the metal layer of the insulated circuit board has a recess that exposes the insulating board thereunder to accommodate an edge of the bonding material, at a position corresponding to at least one corner of the semiconductor element,
- wherein a space in which the bonding material is not present is formed between the recess and the back surface of the semiconductor element at said at least one corner that faces the recess, thereby exposing the back surface of the semiconductor element at said at least one corner, and
- wherein the bonding material is electrically conductive.
3 more elements
A method of manufacturing a semiconductor device, comprising:
- preparing an insulated circuit board that includes an insulating board and a circuit pattern made of a metal layer on the insulating board;
- arranging a semiconductor element on the metal layer with a bonding material interposed therebetween, covering a substantially entire back surface of the semiconductor element, the semiconductor element having a polygonal shape when viewed in a plan view;
- and
- melting and thereafter hardening the bonding material so as to bond the semiconductor element to the metal layer,
- wherein the circuit pattern of the insulated circuit board has a recess that exposes the insulating board thereunder to accommodate an edge of the melted and hardened bonding material, at a position corresponding to at least one corner of the semiconductor element,
- wherein a space in which the bonding material is not present is formed between the recess and the back surface of the semiconductor element at said at least one corner that faces the recess, thereby exposing the back surface of the semiconductor element at said at least one corner, and
- wherein the bonding material is electrically conductive.
4 more elements
Dependencies are inferred from the claim text.