Method of using a processing oven
AssigneeYield Engineering Systems, Inc.
InventorsM Ziaul Karim, Lei Jing, Kenneth Sautter
Life of this patent
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Abstract
A method of using an oven includes supporting a substrate on a rotatable spindle in a processing chamber of the oven and rotating the substrate. The method may also include raising the spindle with the substrate to a heating zone and activating a lamp assembly to heat a top surface of the substrate. The substrate may then be lowered to a dosing zone and a chemical vapor directed into the processing chamber above the substrate. The substrate may then be further heated using the lamp assembly and cooled.
Claims20
A method of using an oven having a processing chamber, comprising:
- supporting a substrate on a rotatable spindle in the processing chamber;
- rotating the spindle with the substrate;
- raising the spindle with the substrate to a heating zone of the processing chamber;
- activating a lamp assembly of the oven to heat a top surface of the substrate, wherein the lamp assembly includes a plurality of spaced-apart lamps;
- after the heating, lowering the spindle with the substrate to a dosing zone of the processing chamber;
- after the lowering, directing a chemical vapor into the processing chamber above the top surface of the substrate;
- after directing the chemical vapor, raising the spindle with the substrate to the heating zone to further heat the top surface of the substrate using the lamp assembly;
- and
- after the further heating, lowering the spindle with the substrate to a cooling zone of the processing chamber.
A method of using a processing oven, comprising:
- supporting a substrate on a rotatable spindle in an enclosure of the processing oven;
- rotating the substrate;
- lowering a pressure in the processing chamber to a value between about 100 milliTorr-100 Torr;
- raising the substrate to a heating zone of the enclosure located at a top region of the enclosure;
- activating a lamp assembly of the oven to heat a top surface of the substrate, wherein the lamp assembly includes a plurality of spaced-apart lamps;
- lowering the substrate to a dosing zone of the enclosure;
- directing a chemical vapor into the enclosure above the top surface of the substrate while directing an inert has into the enclosure below the substrate;
- after directing the chemical vapor, raising the substrate to the heating zone to further heat the top surface of the substrate using the lamp assembly;
- and
- after further heating the top surface of the substrate, lowering the substrate to a cooling zone of the enclosure.
Dependencies are inferred from the claim text.