US 11,456,272 B2 · Straight wirebonding of silicon dies

Abstract

A method including stacking a number of silicon dice such that one or more edges of the dice are in vertical alignment, where the one or more edges include a number of connection pads. The method also includes positioning a connecting wire on a substantially perpendicular axis to the one or more edges. The connecting wire includes a number of solder blocks formed thereon. The solder blocks are spaced at intervals associated with a distance between a first set of aligned connection pads on the dice. The connecting wire is positioned such that the solder blocks are in contact with the first set of aligned connection pads. The method also includes applying heat to cause the solder blocks to reflow and physically and electrically couple the connecting wire to the connection pads.

Claims20

Dependent claims

An apparatus comprising:

a substrate;
two or more silicon dice, wherein a first die is disposed on the substrate and a second die is stacked on the first die, and the dice comprising:
an upper planar surface parallel to the substrate;
a lower planar surface parallel to the upper planar surface and spaced at a first distance from the upper planar surface;
at least a first edge portion disposed between, and perpendicular to, the upper planar surface and the lower planar surface;
and
at least a first set of connection pads disposed on the at least first edge portion and wherein the first set of connection pads are in vertical alignment with each other;
a conductive element configured to be coupled to the first set of connection pads;
and
a plurality of solder blocks coupled to the conductive element and spaced at an interval associated with a distance between the connection pads of the first set of connection pads.

7 more elements

Dependencies are inferred from the claim text.

Straight wirebonding of silicon dies

Life of this patent

Straight wirebonding of silicon dies

Life of this patent

Abstract

Claims20