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US 11,456,262 B2Granted
Integrated circuit
AssigneeTexas Instruments Incorporated
InventorsYuki Sato, Kenji Otake, Takafumi Ando, Jeffrey Morroni, Charles Allen Devries, Jr., Kristen Nguyen Parrish
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Abstract
An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.
Claims11
A method of fabricating integrated circuits, the method comprising:
- providing a substrate having an array of electronic components;
- attaching a sheet array of substrate-based coils to the substrate where respective substrate-based coils are aligned with respective electronic components;
- encapsulating the substrate having the array of electronic components and the sheet of substrate-based coils with a magnetic mold compound;
- and
- singulating the array of electronic components and respective substrate-based coils to form the integrated circuits.
2 more elements
Dependencies are inferred from the claim text.