Semiconductor package structures and methods of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHui-Yu Lee, Hui-Chen Hsu
Life of this patent
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Abstract
A semiconductor package structure includes a semiconductor package structure includes a first supporting bar, a second supporting bar and an encapsulant. The second supporting bar is adjacent to the first supporting bar. The first supporting bar and the second supporting bar extend substantially along a first direction. The encapsulant covers the first supporting bar and the second supporting bar. The encapsulant defines a first recess and a second recess recessed from a lower surface of the encapsulant. The first recess extends substantially along a second direction different from the first direction. The second recess is located between the first recess and the second supporting bar.
Claims14
A semiconductor package structure, comprising:
- a first supporting bar;
- a second supporting bar adjacent to the first supporting bar, wherein the first supporting bar and the second supporting bar extend substantially along a first direction;
- and
- an encapsulant covering the first supporting bar and the second supporting bar, wherein the encapsulant defines a first recess and a second recess recessed from a lower surface of the encapsulant, the first recess extends substantially along a second direction different from the first direction, and the second recess is located between the first recess and the second supporting bar, wherein the second recess has a closed end exposing a lateral surface of the second supporting bar and an open end connecting the first recess, and an aperture of the second recess tapers off from the closed end to the open end of the second recess.
Dependencies are inferred from the claim text.