Panel level packaging for devices
AssigneePyxis Cf Pte. Ltd.
InventorAmlan Sen
Life of this patent
Estimating the term…
Abstract
Panel level packaging (PLP) with high accuracy and high scalability is disclosed. The PLP employs an alignment carrier with a low coefficient of expansion which is configured with die regions having local die alignment marks. For example, local die alignment marks are provided for each die attach region. Depending on the size of the panel, it may be segmented into blocks, each with die regions with local die alignment marks. In addition, a block includes an alignment die region configured for attaching an alignment die. Linear and non-linear positional errors are reduced due to local die alignment marks and alignment dies. The use of local die alignment marks and alignment dies results in increase yields as well as scaling, thereby improving throughput and decreasing overall costs.
Claims20
An alignment system for a die bonder comprising:
- an integrated camera module configured
- to view downwards in a vertical direction towards an active surface of an alignment carrier when mounted on the die bonder, the integrated camera module comprising a light source which is configured to emit a light having a wavelength for penetrating through an adhesive layer disposed on the active surface of the alignment carrier to enable the integrated camera module to detect local alignment marks of a die bond region of interest on the active surface of the alignment carrier with die bond regions having local alignment marks, and
- to view upwards in the vertical direction for viewing a bottom surface of a die when attached to a bond head of the die bonder for die bonding;
- and
- an alignment controller, wherein the alignment controller is configured to receive input from the camera module, the alignment controller is configured to align the die when attached to the bond head to the die bond region of interest for die bonding based on the input from the camera module in accordance with the local alignment marks of the die bond region of interest.
A method for die bonding comprising:
- providing an alignment carrier comprising
- die bond regions defined on an active surface of the alignment carrier, and
- local alignment marks on the active surface for each die bond region, wherein the local alignment marks facilitate local alignment of bonding to the die bond regions;
- mounting the alignment carrier onto a base assembly of a die bonder;
- picking up a first die for die bonding onto a first die bond region on the alignment carrier by a bond head of the die bonder;
- aligning the first die to the first die bond region according to the local alignment marks of the first die bond region, the aligning the first die to the first die bond region comprising using an alignment system which is configured
- to view downwards in a vertical direction for detecting the local alignment marks of the first die bond region, and
- to view upwards in the vertical direction for viewing a bottom surface of the first die;
- sending information of the alignment system to a controller, wherein the controller aligns the first die to the first die bond region based on the information from the alignment system according to the local alignment marks of the first die bond region;
- and
- moving the first die downwards vertically by the bond head to the alignment carrier after alignment of the first die to the first die bond region is achieved to bond the first die on the first die bond region of the alignment carrier.
Dependencies are inferred from the claim text.