Semiconductor device
AssigneeKioxia Corporation
InventorsTakao Sueyama, Yosuke Komori
Life of this patent
Estimating the term…
Abstract
A semiconductor device according to the present embodiment comprises a first metallic line. The first metallic line is provided above a substrate and extends in a first direction with a first width. At least one second metallic line is connected to the first metallic line and extends in a second direction from the first metallic line with a second width that is smaller than the first width. A dummy metallic line is arranged adjacently to the at least one second metallic line, connected to the first metallic line, and extends in the second direction from the first metallic line. The dummy metallic line is not electrically connected to lines other than the first metallic line.
Claims20
A semiconductor device comprising:
- a first metallic line provided above a substrate and extending in a first direction with a first width in a plan view of the device;
- at least one second metallic line directly connected to the first metallic line and extending in a second direction from the first metallic line with a second width that is smaller than the first width in the plan view;
- and
- a dummy metallic line arranged adjacently to the at least one second metallic line in the plan view, directly connected to the first metallic line, and extending in the second direction from the first metallic line in the plan view while not electrically connected to lines other than the first metallic line.
A semiconductor device comprising:
- a first metallic line provided above a substrate and extending in a first direction with a first width in a plan view of the device;
- a plurality of second metallic lines directly connected to the first metallic line and extending in a second direction from the first metallic line with a second width that is smaller than the first width in the plan view;
- and
- a dummy metallic line arranged adjacently to one side of an array of the second metallic lines in the plan view, directly connected to the first metallic line, and extending in the second direction from the first metallic line in the plan view while not electrically connected to lines other than the first metallic line.
A semiconductor device comprising:
- a first metallic line provided above a substrate and extending in a first direction with a first width in a plan view of the device;
- a plurality of second metallic lines directly connected to the first metallic line and extending in a second direction from the first metallic line with a second width that is smaller than the first width in the plan view;
- and
- a dummy metallic line arranged adjacently to an array of the second metallic lines in the plan view, directly connected to the first metallic line, and extending in the second direction from the first metallic line in the plan view while not electrically connected to lines other than the first metallic line, wherein
- a width of one of the second metallic lines located at one end of the array of the second metallic line is larger than that of other second metallic lines in the plan view.
Dependencies are inferred from the claim text.