Semiconductor package structure and manufacturing method thereof

A manufacturing method of a semiconductor package structure, comprising:

• providing a circuit substrate, having a first surface and a second surface opposite to the first surface, wherein the circuit substrate comprises a center region and a peripheral region;
• disposing at least two chips on the first surface, wherein each of the at least two chips has an active surface facing the circuit substrate and comprises:
• a plurality of first conductive connectors and a plurality of second conductive connectors, disposed on the active surface, wherein the plurality of first conductive connectors are located in the center region, and the plurality of second conductive connectors are located in the peripheral region;
• and
• a pitch between two adjacent first conductive connectors is less than a pitch between two adjacent second conductive connectors;
• forming an encapsulant to encapsulate the at least two chips;
• and
• forming a redistribution layer on the second surface of the circuit substrate, wherein the plurality of first conductive connectors are electrically connected to the redistribution layer by the circuit substrate, and the plurality of second conductive connectors are electrically connected to the circuit substrate.