Semiconductor module, vehicle and manufacturing method

A semiconductor module comprising a semiconductor apparatus and a cooling apparatus, wherein

• the semiconductor apparatus includes a semiconductor chip and a circuit board, the semiconductor chip being mounted on the circuit board, and
• the cooling apparatus includes:
• a top plate, the semiconductor apparatus being mounted on the top plate;
• a jacket including a side wall connected to the top plate, a bottom plate connected to the side wall and facing the top plate, and a cooling pin fin extending in such a manner as to taper from the bottom plate toward the top plate, wherein at least the bottom plate and the cooling pin fin are integrally formed, and at least one of ends of the cooling pin fin is firmly fixed to the top plate;
• a coolant flow portion defined by the top plate and the jacket, and for flow of coolant;
• an inlet in communication with one of sections of the coolant flow portion, the one section being associated with one direction, and for letting coolant into the coolant flow portion;
• and
• an outlet in communication with another section of the coolant flow portion, the other section being associated with another direction opposite to the one direction, and for letting coolant out of the coolant flow portion, and wherein
• the cooling pin fin has a substantially rhombic shape long along a direction from the one section toward the other section and having round corners when viewed in cross section in a plane parallel to a principal surface of the top plate, and
• a curvature radius of the corners in the cross section of the cooling pin fin is greater at a position close to the top plate than at a position close to the bottom plate.