Back to results
US 11,456,232 B2Granted
Thermal assemblies for multi-chip packages
AssigneeIntel Corporation
InventorsZhimin Wan, Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw Kebede Gebrehiwot, Chandra Mohan Jha
Life of this patent
Estimating the term…
Abstract
Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.
Claims22
An apparatus, comprising:
- a package substrate for a multi-chip package (MCP);
- an IC component coupled to a surface of the package substrate;
- and
- a thermal assembly, including:
- a lid having legs perpendicular to the surface of the package substrate, the legs coupled to the surface of the package substrate with a sealant such that the IC component is between the lid and the package substrate, and the lid further comprises:
- a heat pipe having a ring shape, the heat pipe including:
- an interior portion configured for flow of a working fluid;
- a thermally conductive outer envelope surrounding the interior portion;
- a wicking material between the interior portion and the outer envelope;
- a thermally conductive region in an opening of the heat pipe;
- and
- a thermally insulative region between the heat pipe and the thermally conductive region, wherein the thermally insulative region includes epoxy.
9 more elements
An apparatus, comprising:
- a package substrate;
- an IC component coupled to a surface of the package substrate;
- and
- a lid coupled to the IC component and the package substrate, wherein the lid comprises:
- a top portion parallel to the surface of the package substrate, the top portion coupled to the IC component;
- a bottom portion perpendicular to the surface of the package substrate, the bottom portion coupled to the package substrate with a sealant;
- and
- a ring-shaped heat pipe in the top portion, wherein the heat pipe includes:
- a channel configured for flow of a working fluid;
- a thermally conductive outer envelope surrounding the channel;
- and
- a wicking material between the channel and the outer envelope;
- a thermally conductive region in an opening of the heat pipe;
- and
- a thermal insulator between the heat pipe and the thermally conductive region, wherein the thermal insulator includes epoxy.
12 more elements
Dependencies are inferred from the claim text.