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US 11,456,231 B2Granted
Heatsink arrangement for integrated circuit assembly and method for assembling thereof
AssigneeFortinet, Inc.
InventorsShen Sunny Zhong, Qian Yu, Han Hsu
Life of this patent
Estimating the term…
Abstract
Various heatsink arrangements, and methods for implementing and using such are discussed.
Claims20
A heatsink arrangement for an integrated circuit assembly having a first board with a first chipset mounted thereon and a second board with a second chipset mounted thereon, the heatsink arrangement comprising:
- a first heatsink comprising a base, having a first side and a second side, and a set of fins extending outwardly from the first side of the base of the first heatsink, with the second side of the base of the first heatsink configured to be disposed in contact with the first chipset;
- and
- a second heatsink comprising a base, having a first side and a second side, and a set of fins extending outwardly from the first side of the base of the second heatsink, with the second side of the base of the second heatsink configured to be disposed in contact with the second chipset,
- wherein the first board and the second hoard are arranged with respect to each other such that the first side of the base of the second heatsink is disposed facing the first side of the base of the first heatsink, with the set of fins of the second heatsink interposed with the set of fins of the first heatsink.
1 more element
A method for assembling an integrated circuit assembly from a first hoard with a first chipset mounted thereon and a second board with a second chipset mounted thereon, the method comprising:
- disposing a first heatsink comprising a base, having a first side and a second side, and a set of fins extending outwardly from the first side of the base of the first heatsink, over the first chipset, with the second side of the base of the first heatsink disposed in contact with the first chipset;
- disposing a second heatsink comprising a base, having a first side and a second side, and a set of fins extending outwardly from the first side of the base of the second heatsink, over the first heatsink such that the first side of the base of the second heatsink is disposed facing the first side of the base of the first heatsink, with the set of fins of the second heatsink interposed with the set of fins of the first heatsink;
- and
- arranging the first board and the second board with respect to each other such that the second side of the base of the second heatsink is disposed in contact with the second chipset.
1 more element
An integrated circuit assembly comprising:
- a first board with a first chipset mounted thereon;
- a second board with a second chipset mounted thereon;
- and
- a heatsink arrangement comprising:
- a first heatsink comprising a base, having a first side and a second side, and a set of fins extending outwardly from the first side of the base of the first heatsink, with the second side of the base of the first heatsink disposed in contact with the first chipset;
- and
- a second heatsink comprising a base, having a first side and a second side, and a set of fins extending outwardly from the first side of the base of the second heatsink, with the second side of the base of the second heatsink disposed in contact with the second chipset,
- wherein the first board and the second board are arranged with respect to each other such that the first side of the base of the second heatsink is disposed facing the first side of the base of the first heatsink, with the set of fins of the second heatsink interposed with the set of fins of the first heatsink.
5 more elements
Dependencies are inferred from the claim text.