Semiconductor package and method of fabricating the same

A package structure, comprising:

• a substrate having bond pads;
• an insulating encapsulant disposed on the substrate, wherein the insulating encapsulant has a ring shape groove located on a top surface of the insulating encapsulant, and a bottom surface of the insulating encapsulant is in contact with the substrate;
• an interposer structure connected to the bond pads of the substrate and encapsulated by the insulating encapsulant, wherein the interposer structure is encircled by the ring shape groove and kept a distance apart from the ring-shape groove;
• a plurality of dies disposed on and electrically connected to the interposer structure;
• and
• a lid disposed on the plurality of dies.

A method of fabricating a package structure, comprising:

• providing a substrate having bond pads;
• disposing an interposer structure on the substrate, and connecting the interposer structure to the bond pads of the substrate;
• disposing a plurality of dies on the interposer structure;
• and
• forming an insulating encapsulant encapsulating the interposer structure, wherein the insulating encapsulant is formed with a ring shape groove that surrounds the interposer structure and the at least one die, and the ring shape groove is separated from the interposer structure and the at least one die by a distance.