Methods for variable etch depths
AssigneeApplied Materials, Inc.
InventorsMorgan Evans, Joseph C. Olson, Rutger Meyer Timmerman Thijssen, Daniel Distaso, Ryan Boas
Life of this patent
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Abstract
Methods of producing grating materials with variable height fins are provided. In one example, a method may include providing a mask layer atop a substrate, the mask layer including a first opening over a first processing area and a second opening over a second processing area. The method may further include etching the substrate to recess the first and second processing areas, forming a grating material over the substrate, and etching the grating material in the first and second processing areas to form a plurality of structures oriented at a non-zero angle with respect to a vertical extending from a top surface of the substrate.
Claims20
A method, comprising:
- providing a mask layer atop a substrate, the mask layer including a first opening over a first processing area and a second opening over a second processing area;
- etching the substrate to recess the first and second processing areas;
- forming a grating material over the substrate;
- and
- etching the grating material in the first and second processing areas to form a plurality of structures oriented at a non-zero angle with respect to a vertical extending from a top surface of the substrate.
A method of forming an optical device, comprising:
- providing a mask layer atop a substrate, the mask layer including a first opening defining a first processing area and a second opening defining a second processing area;
- etching the substrate to recess the first and second processing areas;
- forming an optical grating material over the substrate;
- and
- forming a plurality of structures by etching a plurality of trenches into the optical grating material in the first and second processing areas, wherein the plurality of structures is oriented at a non-zero angle with respect to a vertical extending from a top surface of the substrate.
A method, comprising:
- providing an ion beam source within a chamber, wherein the chamber is operable to deliver an ion beam to a substrate, and wherein the substrate includes a first processing area separated from a second processing area by a mask element;
- etching the substrate to recess the first and second processing areas, wherein the first and second processing areas are recessed to different depths relative to a top surface of the substrate;
- forming an optical grating material over the substrate;
- and
- forming a plurality of structures by etching a plurality of trenches into the optical grating material in the first and second processing areas, wherein the plurality of structures is oriented at a non-zero angle with respect to a vertical extending from the top surface of the substrate.
Dependencies are inferred from the claim text.