Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup head
AssigneeSamsung Electronics Co., Ltd.
InventorsJin-San Jung, Hyunseok Choi, Jun-Su Lim
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Abstract
A stage structure for a semiconductor fabrication process is disclosed. The stage structure may include a stage and a pickup head tilting control device. The pickup head tilting control device may include a correction plate, a tilting driving device which is coupled to the correction plate and is configured to adjust an inclination angle of the correction plate, and a control circuitry configured to control the tilting driving device. The correction plate may include a correction surface which is selectively in contact with a suction surface of a pickup head.
Claims16
A stage structure for a semiconductor fabrication process, comprising:
- a stage;
- and
- a pickup head tilting control device,
- wherein the pickup head tilting control device comprises;
- an inclination correction plate,
- a tilting driver, coupled to the inclination correction plate and configured to adjust an inclination angle of the inclination correction plate, and
- a control processing circuitry configured to control the tilting driver;
- wherein the inclination correction plate comprises a correction surface which is selectively in contact with a suction surface of a pickup head,
- wherein the pickup head is configured to selectively contact the correction surface by moving downwardly to fully contact the inclination correction plate, and
- the tilting driver of the pickup head tilting control device is configured to adjust the inclination angle of the inclination correction plate to change an inclination angle of the suction surface in response to the inclination correction plate contacting the suction surface.
Dependencies are inferred from the claim text.