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US 11,456,192 B2Granted
Apparatus and method for cooling substrate
AssigneeSEMIgear, Inc.
InventorsJonghoon Kim, Jihoon Kim
Life of this patent
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Abstract
The inventive concept relates to a substrate cooling apparatus for cooling a substrate. The substrate cooling apparatus includes a chuck on which the substrate is placed and a cooling unit that cools the chuck. The cooling unit includes a heat dissipation plate that has the chuck placed on an upper surface thereof and that dissipates heat of the chuck.
Claims10
An apparatus for cooling a substrate, the apparatus comprising:
- a chuck on which the substrate is placed;
- and
- a cooling unit configured to cool the chuck,
- wherein the cooling unit includes a heat dissipation plate having the chuck placed on an upper surface thereof, the heat dissipation plate being configured to dissipate heat of the chuck,
- wherein the cooling unit further includes:
- an inner cover having the heat dissipation plate supported on an upper surface of a bottom wall thereof, the inner cover being configured to move in a vertical direction;
- and
- a cooling member provided under the bottom wall of the inner cover and configured to cool the inner cover.
5 more elements
Dependencies are inferred from the claim text.