Substrate processing apparatus and method of manufacturing semiconductor device

A substrate processing apparatus comprising:

• a first process module that includes a first process container for processing a substrate;
• a second process module that is disposed adjacent to a side surface of the first process module and includes a second process container for processing a substrate;
• a first utility system that is disposed adjacent to extend backward from a back surface of the first process module and includes:
• a first exhaust part configured to exhaust an inside of the first process container;
• and
• a first supply part configured to supply a processing gas into the first process container;
• and
• a second utility system that is disposed adjacent to extend backward from a back surface of the second process module and includes:
• a second exhaust part configured to exhaust an inside of the second process container;
• and
• a second supply part configured to supply a processing gas into the second process container,
• wherein the first utility system is installed along an outer side surface of the substrate processing apparatus opposite to the second utility system,
• wherein the second utility system is installed along another outer side surface of the substrate processing apparatus opposite to the first utility system,
• wherein a maintenance area, which is commonly used for the first process module and the second process module, is formed continuously between the first utility system and the second utility system, behind the back surface of the first process module and the back surface of the second process module, and
• wherein a first maintenance door is installed on the first process module to face the maintenance area, and a second maintenance door is installed on the second process module to face the maintenance area.