Member for semiconductor manufacturing apparatuses

A member for semiconductor manufacturing apparatuses, comprising a ceramic component and a metal component bonded together with a thermosetting sheet, wherein

• the thermosetting sheet is made of a cured epoxy-acrylic adhesive,
• the cured epoxy-acrylic adhesive comprising (A) an epoxy resin capable of hydrogen transfer polyaddition, (B) an acrylic rubber selected from the group consisting of acrylic rubbers having an epoxy group mainly composed of an alkyl acrylate or an alkyl methacrylate and acrylic rubbers having a carboxy group mainly composed of alkyl acrylate or alkyl methacrylate, and (C) a curing agent, and
• an amount of the epoxy resin is 9 to 29 times greater than an amount of the curing agent,
• wherein a mass percentage constituted by the epoxy resin is lower than a mass percentage constituted by the acrylic rubber,
• wherein the cured epoxy-acrylic adhesive, after bonding of the ceramic component and the metal component, has a shear strength of 0.3 MPa or more, a shear strain of 1.4 or more, and a shear elastic modulus Z in a range of 0.048 Z 2.350 before and after a thermal history of 150° C. for 1000 hours, and
• wherein, when adherends are disposed on both sides of an adhesive sheet, which is a sheet before heat curing treatment of the cured epoxy-acrylic adhesive, and pressures of 0.1 to 1.0 MPa are applied at 130° C. for one hour to the adherends, an amount by which the cured epoxy-acrylic adhesive is squeezed out from a side surface of the adhesive sheet is 0.90 mm or less.