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US 11,456,188 B2Granted
Method of making flexible semiconductor device with graphene tape
AssigneeNXP USA, Inc.
InventorsYou Ge, Meng Kong Lye, Zhijie Wang
Life of this patent
Estimating the term…
Abstract
A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.
Claims20
A method for assembling a semiconductor device, the method comprising:
- providing a first tape that has a plurality of bonding pads and a plurality of conductive traces comprising graphene formed thereon, wherein the plurality of bonding pads are formed in a first center area of the first tape, and the plurality of conductive traces are electrically connected to and extend from respective bottom surfaces of the plurality of bonding pads to a first peripheral area surrounding the first center area;
- attaching a first semiconductor die to the first tape and electrically connecting the first die to the plurality of bond pads by way of a plurality of die electrical contacts;
- and
- attaching a second center area of a second tape to the first semiconductor die, and a second peripheral area surrounding the second center area of the second tape to the first peripheral area of the first tape by way of an adhesive therebetween, wherein the first and second tapes encapsulate the first semiconductor die, the plurality of die electrical contacts, and at least a part of the plurality of conductive traces.
1 more element
A method for assembling a semiconductor device, the method comprising:
- providing a first tape that has a plurality of bonding pads and a plurality of conductive traces formed thereon, wherein the plurality of bonding pads and the plurality of conductive traces comprise graphene, wherein the plurality of bonding pads are formed in a first center area of the first tape, and the plurality of conductive traces are electrically connected to and extend from respective bottom surfaces of the plurality of bonding pads to a first peripheral area surrounding the first center area;
- attaching a first semiconductor die to the first tape and electrically connecting the first die to the plurality of bond pads by way of a plurality of die electrical contacts;
- and
- attaching a second center area of a second tape to the first semiconductor die, and a second peripheral area surrounding the second center area of the second tape to the first peripheral area of the first tape by way of an adhesive therebetween, wherein the first and second tapes encapsulate the first semiconductor die, the plurality of die electrical contacts, and the plurality of conductive traces.
1 more element
Dependencies are inferred from the claim text.