Wafer structure and trimming method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHao-Ning Chiang, Ming-Te Chuang
Life of this patent
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Abstract
A wafer structure and a trimming method thereof are provided. The trimming method includes the following steps. A first wafer having a first surface and a second surface opposite to the first surface is provided. A first pre-trimming mark is formed on the first surface of the first wafer, where forming the first pre-trimming mark includes forming a plurality of recesses arranged as a path along a periphery of the first wafer. The first wafer is trimmed on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.
Claims20
A trimming method, comprising:
- providing a first wafer having a first surface and a second surface opposite to the first surface;
- forming a first pre-trimming mark on the first surface of the first wafer, wherein forming the first pre-trimming mark comprises forming a plurality of recesses arranged as a path along a periphery of the first wafer;
- and
- trimming the first wafer on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.
A trimming method, comprising:
- forming a first trimming path arranged by a plurality of first trenches spaced from one another on a first surface of a first wafer and surrounding a perimeter of the first wafer;
- and
- moving a trimming tool along the first trimming path to shorten a trimming route on the first surface of the first wafer by cutting through the plurality of first trenches.
A wafer structure, comprising:
- a wafer comprising a first surface, a second surface opposite to the first surface, and an edge connecting the first surface and the second surface,
- wherein the edge is substantially perpendicular to the first surface and the second surface of the wafer, the edge has first regions surrounding by a second region, the individual first regions are separated and spaced apart from one another by the second region, and a texture feature of the second region is different from texture features of the first regions.
Dependencies are inferred from the claim text.