Method of lapping semiconductor wafer and semiconductor wafer
AssigneeSumco Corporation
InventorsDaisuke Hashimoto, Satoshi Matagawa, Tomohiro Hashii
Life of this patent
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Abstract
Provided is a method of lapping a semiconductor wafer, which can suppress the formation of a ring-shaped pattern in a nanotopography map. The method of lapping a semiconductor wafer includes: a stopping step of stopping lapping of a semiconductor wafer; a reversing step of reversing surfaces of the semiconductor wafer facing a upper plate and a lower plate after the stopping step; and a resuming step of resuming lapping of the semiconductor wafer after the reversing step while maintaining the reversal of the surfaces facing the plates.
Claims5
A method of lapping a semiconductor wafer, in which while a solution containing abrasive grains is supplied to a gap between an upper plate and an lower plate placed to face each other, a carrier plate on which a semiconductor wafer is loaded is made to perform a planetary motion, thereby lapping a front surface and a back surface of the semiconductor wafer directly in contact with the upper plate and the lower plate, the method comprising:
- starting lapping of the semiconductor wafer by supplying the solution, wherein no polishing pad is present between the upper plate and the lower plate;
- stopping lapping of the semiconductor wafer;
- reversing surfaces of the semiconductor wafer facing the upper plate and the lower plate after the stopping;
- and
- resuming lapping of the semiconductor wafer after the reversing while maintaining the reversal of the surfaces facing the upper plate and the lower plate.
A method of lapping a semiconductor wafer, in which a carrier plate on which a semiconductor wafer loaded between an upper plate and a lower plate is made to perform a planetary motion, the method comprising:
- starting lapping of a front surface and a back surface of the semiconductor wafer by supplying a solution including abrasive grains to a gap between the upper plate and the lower plate, and the solution being in contact with both the front surface and the back surface during lapping;
- stopping lapping of the semiconductor wafer;
- reversing surfaces of the semiconductor wafer facing the upper plate and the lower plate after the stopping;
- and
- resuming lapping of the semiconductor wafer after the reversing while maintaining the reversal of the surfaces facing the upper plate and the lower plate.
Dependencies are inferred from the claim text.