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US 11,456,116 B2Granted
Magnetic coils in locally thinned silicon bridges and methods of assembling same
AssigneeIntel Corporation
InventorsAndreas Augustin, Bernd Waidhas, Sonja Koller, Reinhard Mahnkopf, Georg Seidemann
Life of this patent
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Abstract
A recess in a die backside surface occupies a footprint that accommodates an inductor coil that is formed in metallization above an active surface of the die. Less semiconductive material is therefore close to the inductor coil. A ferromagnetic material is formed in the recess, or a ferromagnetic material is formed on a dielectric layer above the inductor coil. The recess may extend across a die that allows the die to be deflected at the recess.
Claims18
A semiconductive apparatus, comprising:
- a semiconductive die including an active surface, a backside surface and a recess in the backside surface;
- a metallization layer on the active surface, wherein the metallization includes an inductor coil positioned above the recess;
- and
- an active surface ferromagnetic layer disposed above the inductor coil.
1 more element
A computing system, comprising:
- a semiconductive die that includes:
- a locally thinned region, wherein the locally thinned region is formed in a recess at a backside surface of the die;
- and active area of the die disposed opposite the backside surface;
- a metallization covering the active area including an inductor coil disposed vertical to the recess;
- an active surface ferromagnetic layer disposed above the inductor coil;
- and
- a mounting substrate onto which the die is disposed.
4 more elements
Dependencies are inferred from the claim text.