Coil device
AssigneeIHI Corporation
InventorsKenji Nishimura, Motonao Niizuma
Life of this patent
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Abstract
A coil device includes a coil unit for stowing a coil part, and a heat dissipation unit thermally connected to the coil unit. The heat dissipation unit has a heat dissipation body, a heat dissipation fin movable relative to the heat dissipation body, and a fin drive mechanism for driving the heat dissipation fin. The heat dissipation unit has a heat dissipation configuration in which the heat dissipation fin projects from the heat dissipation body in a direction intersecting a winding axis, and a stowed configuration in which the heat dissipation fin is stowed in the heat dissipation body.
Claims11
A coil device, comprising:
- a coil unit having a coil part and a housing configured to accommodate the coil part that has a main surface;
- and
- a heat dissipation unit thermally connected to the coil unit,
- wherein the heat dissipation unit includes a heat dissipation body thermally connected to the main surface and having an accommodation part, a heat dissipation member configured to be movable relative to the heat dissipation body in a direction orthogonal to a winding axis of the coil part where a winding of the coil part is wound around the winding axis and thermally connected to the heat dissipation body and a driver configured to move the heat dissipation member, and
- wherein the heat dissipation unit has a first configuration in which the heat dissipation member projects from the heat dissipation body in a direction along the main surface, and a second configuration in which the heat dissipation member is stowed in the accommodation part of the heat dissipation body.
Dependencies are inferred from the claim text.