Multilayer board and manufacturing method thereof
AssigneeMurata Manufacturing Co., Ltd.
InventorKanto Iida
Life of this patent
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Abstract
A multilayer board includes a first substrate made of a thermoplastic resin, a first conductor pattern provided on the first substrate, a second substrate made of the thermoplastic resin, and a second conductor pattern provided on the second substrate. An insulation coating which covers the first conductor pattern is partially disposed between the first substrate and the second substrate. The insulation coating is made of a material having lower fluidity at a predetermined press temperature than fluidities of the first substrate and the second substrate, and a plurality of substrates including the first substrate and the second substrate are laminated and thermally compressed and bonded at the press temperature.
Claims9
A multilayer board comprising:
- a first substrate made of a thermoplastic resin;
- a first conductor pattern provided on an upper surface of the first substrate;
- a second substrate made of a thermoplastic resin;
- a second conductor pattern provided on an upper surface of the second substrate;
- a via conductor provided in the second substrate and providing an inter-layer connection between the first conductor pattern and the second conductor pattern;
- and
- an insulation coating made of a material having lower fluidity at a predetermined press temperature than fluidities of the first substrate and the second substrate, and at least partially disposed between the first substrate and the second substrate to cover the first conductor pattern;
- wherein
- the second substrate is in contact with the upper surface of the first substrate, and the first conductor pattern and the second conductor pattern are closest to each other in a lamination direction;
- the multilayer board further comprises a plurality of substrates including the first substrate and the second substrate that have been laminated and thermally compressed and bonded to each other at the predetermined press temperature;
- and
- by the thermal compression and bonding, the first conductor pattern and the second conductor pattern are connected to each other by the via conductor and not by the insulation coating.
Dependencies are inferred from the claim text.